BGA (Ball Grid Array) Assembly Services with X-ray Inspection

MOKO has been providing BGA assembly, BGA rework and BGA Reballing services in EMS industry for 8 years. With state-of-the-art BGA placement equipment, correct BGA assembly processes and X-ray test equipment, you can rely on us to build high quality and good yield rate BGA boards.

BGA Assembly Capability

We have a wealth of experience handling all types of BGAs from micro BGAs (2mmX3mm) to large size BGAs (45 mm); from ceramic BGAs to plastic BGAs. We are capable of placing minimum 0.4 mm pitch BGAs on your PCB board.

BGA Assembly

Six automated placement systems available with Vision Systems capable of inspecting solder ball coverage

Two automated systems available with 3-D laser capable of inspecting solder ball height

Automatic placement of CBGA, PBGA and MBGA

Verification of BGA’s using Phoenix real-time x-ray system

Automated BGA Assembly

Rework Capabilities

Removing & Replacing BGA’s & MBGA’s

Experienced with Ceramic & Plastic BGA’s

Reballing BGA’s & MBGA

GA Assembly X-Ray Inspection

We use an X-Ray machine to detect various defects which might occur during BGA assembly. Through X-ray inspection, we can eliminate soldering problems on the board, such as paste bridging and insufficient ball melting. Also, our X-Ray support software can calculate the gap size in the ball to make sure it follows IPC Class II standard. Our experienced technicians can also use 2D X-rays to render 3D images in order to check such problems as PCB broken vias in inner layers and BGA balls' cold solder.

To make an inquiry, please send your requirement to jenny@mokotechnology.com.cn